E-Material

Article summary

E-Material, also called E Material, is a metal matrix composite consisting of beryllium matrix with beryllium oxide particles. It has high thermal conductivity (210-230 W/m K), and its thermal expansion can be adjusted to match other materials, e.g. silicon and gallium arsenide chips and various ceramics. It is chiefly used in microelectronics as substrate for power semiconductor devices and high density multi-chip modules, where it aids with removal of waste heat. E-materials have low weight and high strength, making them especially suitable for aerospace technology. Their high elastic modulus is favorable for absorbing vibrations and lowering material fatigue of attached modules and wire bonds. Several variants exist: * E-20, containing 80 vol.% of beryllium and 20 vol.% (25.8-32.25 w.%) beryllium oxide. Its thermal conductivity is 210 W/(m·K). Its thermal expansion coefficient is 8.7. Its density at 25 °C is 2.045 g/cm 3 . * E-40, containing 60 vol.% of beryllium and 40 vol.% (49.5-54.8 w.%) beryllium oxide. Its thermal conductivity is 220 W/(m·K). Its thermal expansion coefficient is 7.5. Its density at 25 °C is 2.277 g/cm 3 . * E-60, containing 40 vol.% of beryllium and 60 vol.% (69.4-73.2 w.%) beryllium oxide. Its thermal conductivity is 230 W/(m·K). Its thermal expansion coefficient is 6.1. Its density at 25 °C is 2.513 g/cm 3 .…

Key claims

No claims recorded.

Discussion questions

1. Summarise the article in your own words. Which single claim would you verify first, and why?
2. Which claim in this article is most likely to be revised as the sources update? How would you check its current status?
3. If two sources disagreed about one of these facts, what would you need in order to trust one over the other?

Bibliography

No sources recorded.